New Microelectronics Park in Nanjing, China
June 24, 2005
The Nanjing Microelectronics Industrial Park, for which the initiative was taken by Professor Q. Y. Ma, director of the US investment firm Time Innovation Ventures, will be based in the Jiangning Development Zone. The park will cover an area of six square kilometers. In the first phase, two square kilometers will be developed starting in 2006. In the park several businesses and factories will be established, including two or three semiconductor package testing businesses, three or four factories producing six- and eight-inch wafers and one or two 12-inch wafers factories. Total investment for these businesses and factories will total US$2.8 billion. According to the development plan, the first investment will be US$150 million for a six-inch wafer production facility starting in the second half of 2005. Work on the eight- and 12-inch wafer production lines will start in 2006 and 2007 respectively.
The company Huayuan has already invested US$80 million in a package testing facility. Construction for the factory buildings will start in January, 2006. Production is projected to start in September of the same year. In 2010 production volume will reach its peak with 4.7 billion units, representing a volume worth of US$125 million. 95% of the production is expected to be sold overseas.